![]() Parts won't fall off (except big parts with very small footprints) unless you'll shake the board. What I can almost guarantee that you will get dead board if you have not couple of scrap boards to try on them first. Obviously BGA forum would be better place. There are cheaper ones with halogen heat lamp but they are total crap. I would say that they are cheapest you can buy to get acceptable results when soldering large BGA's. ![]() They are in budget range, so not perfect at all. For example: But I can't call them super duper stations. Board warping also is a serious problem, that's why big preaheaters are needed.There are large IR or hot air stations with big preheaters and tight temperature control for this. Trust me, soldering BGA is completely different from soldering SMT resistor or QFN IC. Problem with such hot air stations is that you can't evenly heat up large area, therefore while you are burning one area, solder is not yet melted in another. the plastic sockets and connectors, won't they melt from the heat? The caps, isn't there a risk that they will pop? Strangely enough I cannot see any electrolytic caps on the motherboard so perhaps this is not an issue, but what applies in the more general case? ![]() Question 5: Are all components designed to take the heat? I.e. The jig that comes with the pre-heater will only hold the motherboard on its edges. Question 4: Is there a risk that the motherboard will bend because of the heat or is it designed to take the heat? Maybe I should make some kind of pcb jig or fixture that prevents the motherboard from carrying its own weight so it won't bend when the heat softens it? I'm hoping that this won't be necessary. Question 2: When I put the motherboard on the pre-heater, there are components on the back-side (facing the heating elements of the pre-heater), won't the solder melt and make these components fall off the PCB? Or will the surface-tension of the melted solder keep them in place anyway? Is there any measure I can take to prevent components from falling off the PCB? Question 3: Can I put the entire motherboard as it is on the pre-heater or should I use some metal shroud that shields all parts of the motherboard but the surface underneath the GPU? Maybe that can damage the pre-heater? I suppose I could take a few layers of household aluminium foil and cut a square in it. It has no RoHS or other markings that I can see that could potentially indicate that a lead-free soldering process has been used in the manufacturing. How can I tell what alloy has been used? The laptop is an Asus, the motherboard was manufactured in 2007, most likely by Foxconn as that brand is mentioned on the motherboard. Quesion 1: What is recommended pre-heater temperature? The melting point of leaded solder is around 180☌ and lead-free about 200☌, if I understand it correctly. I'm new to this and I've never done this before. I have read a few guides but there are still some questions that are still unresolved before I continue. I have an Aoyue Int2703A+ soldering station combined with the Aoyue Int883 pre-heater and I want to reflow and reball the GPU chip on a laptop motherboard.
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